New Book - 3D Microelectronic Packaging: From Architectures to Applications (Springer Series in Advanced Microelectronics, 64)

Author: Yan Li, Deepak Goyal Title: 3D Microelectronic Packaging: From Architectures to Applications (Springer Series in Advanced Microelectronics, 64) Publisher: Springer Publication Date: 11/24/2020 ISBN: 9789811570896 Hardcover  (English)

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